FINAL YEARS PROJECT

FYP2 WEEK 5

Title : Bluetooth Module circuit

ANALYSIS

-Bluetooth Module is no need to be soldered on its pin as compare to the other circuits that I have done in previous week since it is just “Plug & Play”.

-The Bluetooth module works on 3.3V level only. High voltage like 5V will permanently damage the module.Therefore, if application requires to be operated at 5V then use a LM1117-3.3 regulator to convert the 5V level to 3.3V level as required by module. By considering this factor, I have to add the LM1117T circuit since the supply voltage from the PIC is 5V. From here, LM 1117T will do its task by reducing the voltage from 5V to 3.3V as required by HC-05 Bluetooth. The diagram as shown below.

Full view of Bluetooth module circuit

FYP2 WEEK 4 (3)

Title :Apply the components on copper board and do the soldering process

-To solder the components on the board according to the PCB design for each circuit.

-To make a connection for all component on the copper board.

Soldering components on PIC circuit Soldering components on Relay circuit

Top view: PIC circuit Bottom view: PIC circuit

Top view: Relay circuit Bottom view: Relay circuit

Troubleshooting the circuit

-After soldering the entire component on the copper board. The circuit must be troubleshoot to check whether the components are connected properly according to the PCB layout.

FYP2 WEEK 4 (2)

Title :Make a drilling process after etching the circuit design

-Holes through a PCB are typically drilled with small-diameter drill bits made of solid coated tungsten carbide. Coated tungsten carbide is recommended since many board materials are very abrasive and drilling must be high RPM and high feed to be cost effective. Drill bits must also remain sharp so as not to mar or tear the traces. Drilling with high-speed-steel is simply not feasible since the drill bits will dull quickly and thus tear the copper and ruin the boards.

-In this project, I am using the Pro’s Kit super mini drill 12V to make the drilling process

Next, drill the holes using a driller.

This is the result after the board had been rubbed by sandpaper to remove the remaining copper that not been covered by carbon ink. Lastly, this circuit is ready to be constructed with the components.

FYP2 WEEK 4(1)

Title :Etching process on the copper board according to the PCB layout

Layout design using Dip-Trace software

-This is the result of PCB Layout design using Dip-Trace software. Design is ready to be printed using Toner Printer (carbon ink). The next step is to attach PCB layout on the copper board.

-Clothes iron will be used to iron the PCB design to attach on the surface of copper board.

-After attaching the PCB design on to the copper board. It will be placed into the etching acid. This process takes about 20 minutes to remove the remaining copper that is not needed.

-The simplest method, used for small-scale production and often by hobbyists, is immersion etching, in which the board is submerged in etching solution such as ferric chloride. Compared with methods used for mass production, the etching time is long. Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching, air is passed through the enchant bath to agitate the solution and speed up etching.

- Chemical etching is usually done with ammonium persulfate or ferric chloride. For my project, Ferric Chloride Anhydrous powder is used for etching process.

-The results of the etching process. Copper is not needed will be eroded,only copper that covered by carbon ink will remain on the board and form a circuit.

FYP2 WEEK 3 (2)

Title : Briefing

- Briefing conducted in TTL 2 at 3 pm

- The briefing is about to give some explanation for the students who are taking the final project for Diploma and Degree programmes. The briefing is about:

· Introduction

· Objectives

· Credits and duration

· Scope of projects

· Title selection

· Project Assessment

· Presentation day

· Submission date of project